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HGTP3N60B3D, HGT1S3N60B3DS
Data Sheet January 2000 File Number 4414.1
7A, 600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode
The HGTP3N60B3D and HGT1S3N60B3DS are MOS gated high voltage switching devices combining the best features of MOSFETs and bipolar transistors. These devices have the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The much lower onstate voltage drop varies only moderately between 25oC and 150oC. The diode used in anti-parallel with the IGBT is the RHRD460. The IGBT used is TA49192. The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors. Formerly Developmental Type TA49193.
Features
* 7A, 600V TC = 25oC * 600V Switching SOA Capability * Typical Fall Time. . . . . . . . . . . . . . . . 115ns at TJ = 125oC * Short Circuit Rating * Low Conduction Loss * Hyperfast Anti-Parallel Diode * Related Literature * TB334 "Guidelines for Soldering Surface Mount - Components to PC Boards
Packaging
JEDEC TO-220AB
E COLLECTOR (FLANGE)
Ordering Information
PART NUMBER HGTP3N60B3D HGT1S3N60B3DS PACKAGE TO-220AB TO-263AB BRAND G3N60B3D G3N60B3D
C
G
NOTE: When ordering, use the entire part number. Add the suffix 9A to obtain the TO-263AB variant in tape and reel, i.e., HGT1S3N60B3DS9A.
Symbol
C
TO-263, TO-263AB
G G E E
COLLECTOR (FLANGE)
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,598,461 4,682,195 4,803,533 4,888,627 4,417,385 4,605,948 4,684,413 4,809,045 4,890,143 4,430,792 4,620,211 4,694,313 4,809,047 4,901,127 4,443,931 4,631,564 4,717,679 4,810,665 4,904,609 4,466,176 4,639,754 4,743,952 4,823,176 4,933,740 4,516,143 4,639,762 4,783,690 4,837,606 4,963,951 4,532,534 4,641,162 4,794,432 4,860,080 4,969,027 4,587,713 4,644,637 4,801,986 4,883,767
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 2000
HGTP3N60B3D, HGT1S3N60B3DS
Absolute Maximum Ratings
TC = 25oC, Unless Otherwise Specified HGTP3N60B3D, HGT1S3N60B3DS Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BVCES Collector Current Continuous At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IC110 Average Diode Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IEC(AVG) Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SSOA Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG Maximum Lead Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TPKG Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tSC Short Circuit Withstand Time (Note 2) at VGE = 10V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . tSC 600 UNITS V
7.0 3.5 4.0 20 20 30 18A at 600V 33.3 0.27 -55 to 150 300 260 5 10
A A
A V V
W W/oC
oC oC oC
s s
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 360V, TJ = 125oC, RG = 82.
Electrical Specifications
PARAMETER
TC = 25oC, Unless Otherwise Specified SYMBOL BVCES ICES TEST CONDITIONS IC = 250A, VGE = 0V VCE = BVCES TC = 25oC TC = 150oC MIN 600 4.5 18 TYP 1.8 2.1 5.4 7.9 18 21 18 16 105 70 66 88 MAX 250 2.0 2.1 2.5 6.0 250 22 25 75 160 UNITS V A mA V V V nA A V nC nC ns ns ns ns J J
Collector to Emitter Breakdown Voltage Collector to Emitter Leakage Current
Collector to Emitter Saturation Voltage
VCE(SAT)
IC = IC110, VGE = 15V
TC = 25oC TC = 150oC
Gate to Emitter Threshold Voltage Gate to Emitter Leakage Current Switching SOA Gate to Emitter Plateau Voltage On-State Gate Charge
VGE(TH) IGES SSOA VGEP Qg(ON)
IC = 250A, VCE = VGE VGE = 20V TJ = 150oC, RG = 82, VGE = 15V L = 500H, VCE = 600V IC = IC110, VCE = 0.5 BVCES IC = IC110, VCE = 0.5 BVCES VGE = 15V VGE = 20V
Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy Turn-Off Energy (Note 1)
td(ON)I trI td(OFF)I tfI EON EOFF
IGBT and Diode at TJ = 25oC ICE = IC110 VCE = 0.8 BVCES VGE = 15V RG = 82 L = 1mH Test Circuit (Figure 19)
2
HGTP3N60B3D, HGT1S3N60B3DS
Electrical Specifications
PARAMETER Current Turn-On Delay Time Current Rise Time Current Turn-Off Delay Time Current Fall Time Turn-On Energy Turn-Off Energy (Note 1) Diode Forward Voltage Diode Reverse Recovery Time TC = 25oC, Unless Otherwise Specified (Continued) SYMBOL td(ON)I trI td(OFF)I tfI EON EOFF VEC trr IEC = 3A IEC = 1A, dIEC/dt = 200A/s IEC = 3A, dIEC/dt = 200A/s Thermal Resistance Junction To Case RJC IGBT Diode NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Turn-On losses include losses due to diode recovery. TEST CONDITIONS IGBT and Diode at TJ = 150oC ICE = IC110 VCE = 0.8 BVCES VGE = 15V RG = 82 L = 1mH Test Circuit (Figure 19) MIN TYP 16 18 220 115 130 210 2.0 MAX 295 175 140 325 2.5 22 28 3.75 3.0 UNITS ns ns ns ns J J V ns ns
oC/W oC/W
Typical Performance Curves
7 ICE , DC COLLECTOR CURRENT (A)
Unless Otherwise Specified
ICE, COLLECTOR TO EMITTER CURRENT (A) 20 18 16 14 12 10 8 6 4 2 0 0 100 200 300 400 500 600 700 TJ = 150oC, RG = 82, VGE = 15V L = 500H
VGE = 15V 6 5 4 3 2 1 0 25 50 75 100 125 150 TC , CASE TEMPERATURE (oC)
VCE , COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 1. DC COLLECTOR CURRENT vs CASE TEMPERATURE
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
3
HGTP3N60B3D, HGT1S3N60B3DS Typical Performance Curves
200 fMAX, OPERATING FREQUENCY (kHz) 100
Unless Otherwise Specified (Continued)
tSC , SHORT CIRCUIT WITHSTAND TIME (s)
TJ = 150oC, RG = 82, L = 1mH, V CE = 480V TC VGE 75oC 15V 75oC 10V 110oC 15V 110oC 10V
VCE = 360V, RG = 82, TJ = 125oC 14 ISC 12 10 8 tSC 6 4 20 15 35 30 25 40
10 fMAX1 = 0.05 / (td(OFF)I + td(ON)I) fMAX2 = (PD - PC) / (EON + EOFF) PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) ROJC = 3.75oC/W, SEE NOTES 1 2 3 4 5 6 7 8 ICE , COLLECTOR TO EMITTER CURRENT (A)
1
10
11
12
13
14
15
VGE , GATE TO EMITTER VOLTAGE (V)
FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT
ICE , COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A)
FIGURE 4. SHORT CIRCUIT WITHSTAND TIME
14 12 10 8 6
30 25 20 15 10 TC = 25oC 5 0 DUTY CYCLE <0.5%, VGE = 15V PULSE DURATION = 250s TC = -55oC
DUTY CYCLE <0.5%, VGE = 10V PULSE DURATION = 250s
TC = -55oC
TC = 150oC
TC = 150oC
TC = 25oC 4 2 0 0 1 2 3 4 5 6 7 8 9 10 VCE, COLLECTOR TO EMITTER VOLTAGE (V)
0
1
2
3
4
5
6
7
8
9
VCE , COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE
FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE
0.7 EOFF, TURN-OFF ENERGY LOSS (mJ) EON , TURN-ON ENERGY LOSS (mJ) RG = 82, L = 1mH, VCE = 480V 0.6 0.5 0.4 0.3 0.2 0.1 0 1 2 3 4 VGE = 15V, TJ = 150oC, TJ = 25oC 5 6 7 8 TJ = 25oC, TJ = 150oC, VGE = 10V
0.6 RG = 82, L = 1mH, VCE = 480V 0.5 TJ = 150oC; VGE = 10V OR 15V 0.4 0.3 0.2 0.1 0 1 2 3 4 5 6 7 8 ICE , COLLECTOR TO EMITTER CURRENT (A)
TJ = 25oC; VGE = 10V OR 15V
ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT
FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT
4
ISC , PEAK SHORT CIRCUIT CURRENT (A) 10
16
45
HGTP3N60B3D, HGT1S3N60B3DS Typical Performance Curves
45 RG = 82, L = 1mH, VCE = 480V tdI , TURN-ON DELAY TIME (ns) 40 35 30 25 20 15 TJ = 25oC, TJ = 150oC, VGE = 15V 10 1 2 3 4 5 6 7 8 ICE , COLLECTOR TO EMITTER CURRENT (A) 10 1 2 3 4 5 6 7 8 ICE , COLLECTOR TO EMITTER CURRENT (A) 70 TJ = 25oC, TJ = 150oC, VGE = 10V trI , RISE TIME (ns) 60 TJ = 25oC AND TJ = 150oC, VGE = 10V 50 40 TJ = 25oC, TJ = 150oC, VGE = 15V 30 20
Unless Otherwise Specified (Continued)
80 RG = 82, L = 1mH, VCE = 480V
FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT
250 td(OFF)I , TURN-OFF DELAY TIME (ns) RG = 82, L = 1mH, VCE = 480V 225 TJ = 150oC, VGE = 15V
FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT
140
RG = 82, L = 1mH, VCE = 480V
tfI , FALL TIME (ns)
200 175 TJ = 150oC, VGE = 10V 150 125 100 TJ = 25oC, VGE = 10V 75 1 2 3 4 5 6 7 8 ICE , COLLECTOR TO EMITTER CURRENT (A) TJ = 25oC, VGE = 15V
120 TJ = 150oC, VGE = 10V OR 15V 100
80
TJ = 25oC, VGE = 10V OR 15V
60 1 2 3 4 5 6 7 8 ICE , COLLECTOR TO EMITTER CURRENT (A)
FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT
FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER CURRENT
ICE, COLLECTOR TO EMITTER CURRENT (A)
VGE , GATE TO EMITTER VOLTAGE (V)
30 PULSE DURATION = 250s 25 TC = -55oC 20 15 10 5 0 5 6 7 8 9 10 11
15 TC = 25oC IG(REF) = 1mA, RL = 171, TC = 25oC 12
9
TC = 150oC
6
VCE = 200V VCE = 400V
VCE = 600V
3
0 12 13 14 15 VGE, GATE TO EMITTER VOLTAGE (V)
0
5
10
15
20
25
Qg , GATE CHARGE (nC)
FIGURE 13. TRANSFER CHARACTERISTIC
FIGURE 14. GATE CHARGE WAVEFORMS
5
HGTP3N60B3D, HGT1S3N60B3DS Typical Performance Curves
Unless Otherwise Specified (Continued)
500 FREQUENCY = 1MHz 400 C, CAPACITANCE (pF) CIES 300
200 COES 100 CRES 0 0 5 10 15 20 25
VCE , COLLECTOR TO EMITTER VOLTAGE (V)
FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE
ZJC , NORMALIZED THERMAL RESPONSE
100 0.5 0.2 10-1 0.1 0.05 0.02 0.01 SINGLE PULSE 10-2 10-5 10-4 PD t2 DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD X ZJC X RJC) + TC 10-3 10-2 10-1 t1 , RECTANGULAR PULSE DURATION (s) 100 101 t1
FIGURE 16. NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE
15 IEC , FORWARD CURRENT (A)
30 TC = 25oC, dIEC/dt = 200A/s t, RECOVERY TIMES (ns) 25 trr 20 15 10 tb 5 0 0.5 ta
12 150oC 9
6
25oC
-55oC
3
0 0 0.5 1.0 1.5 2.0 2.5 3.0 VEC , FORWARD VOLTAGE (V)
1
2
3
4
IEC , FORWARD CURRENT (A)
FIGURE 17. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP
FIGURE 18. RECOVERY TIME vs FORWARD CURRENT
6
HGTP3N60B3D, HGT1S3N60B3DS Test Circuit and Waveforms
HGTP3N60B3D 90% VGE EOFF L = 1mH RG = 82 VCE 90% DUT + ICE VDD = 480V 10% td(OFF)I tfI trI td(ON)I 10% EON
-
FIGURE 19. INDUCTIVE SWITCHING TEST CIRCUIT
FIGURE 20. SWITCHING TEST WAVEFORMS
Handling Precautions for IGBTs
Insulated Gate Bipolar Transistors are susceptible to gate-insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler's body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as "ECCOSORBD LD26TM" or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate opencircuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended.
Operating Frequency Information
Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 5, 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows fMAX1 or fMAX2; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. td(OFF)I and td(ON)I are defined in Figure 20. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM. td(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RJC. The sum of device switching and conduction losses must not exceed PD . A 50% duty factor was used (Figure 3) and the conduction losses (PC) are approximated by PC = VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 20. EON is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e., the collector current equals zero (ICE = 0).
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com 7
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